Journal Paper

Paper Title - Thermal Radiation Analysis for Led Products Platform


Abstract
In this paper, LEDs have attracted attention as an alternative to the regulation of incandescent lamps around the world. LEDs are characterized by high efficiency and long life, but 80 to 85% of the power is converted into heat, and the generated heat directly adversely affects the chip, thereby reducing the light output efficiency, shortening the color temperature variation, and shortening the service life. Inevitably weak heat characteristics of the LED material. In order to compare these characteristics, we conducted a simulation. The simulation uses the MIDAS NFX CFD 2014 R2 program. Simulation was performed on two CAD models. As a result, excellent results were obtained in heat dissipation in PC materials. The simulation uses the MIDAS NFX CFD 2014 R2 program. One CAD model was simulated, and as a result, the PC material showed excellent results in heat dissipation. Keywords- Heat Transfer Analysis, Heat Flow Simulation, Conductive Material.


Author - Jonghawn Lee, Juyoung Jang

Citation - Jonghawn Lee   ,   Juyoung Jang   ,   Jonghawn Lee, Juyoung Jang " Thermal Radiation Analysis for Led Products Platform " , International Journal of Industrial Electronics and Electrical Engineering , Volume-5,Issue-10  ( Oct, 2017 )

Indexed - Google Scholar


| PDF |
Viewed - 1
| Published on 2017-12-29